TOPIC: Advances in CMP Applications and Research

AGENDA:                         

1:00 pm Welcome and Acknowledgment of sponsors; by conference co-chairs Scott Lawing (Kinik North America) and Tricia Burroughs (GlobalFoundries)

1:10 pm Semiconductors and the CHIPS Act: What Happens Next?, Dr. Eric Breckenfeld, (Semiconductor Industry Association)

1:35 pm Economic Trends Shaping Semiconductor Demand, Duncan Meldrum. PhD, CBE (Hilltop Economics LLC)

2:00 pm Trends with Sustainability and Emerging Developments in Wet and Dry Processes, Michael Corbett (Linx Consulting)

2:25 pm Announcements

2:35 pm CMP Removal Rate Modeling with the Shear Force Law, Len Borucki, Y. Sampurno and A. Philipossian (Araca, Inc.)

3:00 pm Quantitative Analysis of CMP Slurry Additives Using Raman Spectroscopy, Timothy Holt and Michelle Sestak (HORIBA Instruments Inc.)

3:25 pm Slurry Activation Through Flucto-CMP, A. Philipossian and Yasa Sampurno (Araca, Inc) Fritz Redeker, Kiana Cahue and Jason Keleher (Lewis University)

3:50 pm Advanced CMP Cleaning Solutions, Geoffrey Yuxin Hu (Brizon Inc.)

4:15 pm Closing remarks

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